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Si Wafer Crack

Crack detection via stress in multicrystalline Si wafer. Image acquired with the GFP™1500. The GFP™2600 system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!

Si Disk in Diametral Compression

The image above was acquired with the GFP™1500. The GFP™2600 Stress Measurement System is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!

Anodic-Bonded Si Structure

Contact stress of trapped particles of anodic-bonded Si structure. Image acquired with the GFP™1600 FPI. The GFP™2600 is also capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!

Si Four-Point Bend Sample

Stress in Si in four-point bend sample. The image above was acquired with the GFP™1500. The GFP™2600 system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!

Si Wafer Crack

Stress near a crack at the edge of a single crystal Si wafer. Image acquired with the GFP™1500. The GFP™2600 system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!

Si Wafer Edge Stress

Residual edge stress of a single crystal Si wafer. Image acquired with the GFP™1500. The GFP™2600 system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!

Crystal Orientation of Si Wafer

Polarization due to crystal orientation of Si wafer. Image acquired with the GFP™1500. The GFP™2600 system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!