EdgeMaster™ 2
The EdgeMaster™ 2 is a photoelastic stress analysis system optimized for measuring edge stresses in clear or tinted glass, and glass with or without black paint. The system works on windshields, sidelights, and backlights.
GFP™2600 (Grey-Field Polariscope)
GFP™2600 Real-time
Grey-Field Polariscope
Real-time Photoelastic Stress Analysis Systems
The GFP™2600 Real-time Photoelastic Stress Analysis (PSA) Systems instantaneously acquire stress images, or videos, via kaleidoscopic optics. The systems create multiple copies of stress images—all exposed to different sets of polarizing optics to measure stress in transparent materials, such as glass, silicon wafers, silicon coated glass and many ceramics. The system can measure stress through painted glass by reflecting light off the paint and can measure load-induced surface strains on opaque materials with applied strain sensitive coatings.
Each PSA system consists of a GFP™ (Grey-Field Polariscope) camera head, an illuminator, and a framework that ties the system together. Selection of lenses can further customize the systems to measure stress in a broad range of materials.
Full Featured Software–DeltaVision™
The GFP2600 Photoelastic Stress Analysis (PSA) System is managed with easy to use DeltaVision™ software—a versatile tool for capturing, presenting, analyzing, and archiving photoelastic data.
DeltaVision Features
Among many other features, the DeltaVision provides:
- Live Image Monitoring
- Image Acquisition and Controls
- Data Interrogation such as Line Plots
- Reference Image Subtraction
- Data Smoothing
- Conversion to Stress Images
GFP2600 System Configurations
The GFP™2600 Real-time PSA System is one of the fastest stress measurement instruments Stress Photonics offers. The camera is easily incorporated into targeted inspection systems, from handheld tools to online installations. The most popular GFP2600 systems are shown below.
GFP™2600 NIR/SWIR
The GFP™2600 NIR/SWIR Real-time Photoelastic Stress Analysis (PSA) System can be used as a general purpose laboratory tool, but is often incorporated into other Stress Photonics products or custom installations.
GFP™2600 STRIP
The GFP™2600 STRIP Real-time Photoelastic Stress Analysis (PSA) System can be used as a general purpose laboratory tool, but is often incorporated into other Stress Photonics products or custom installations.
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GFP2600 Real-time Strain Analysis
This video demonstrates real-time strain analysis of a 3 Mil LDPE (Low Density Polyethylene) plastic sheet acquired with the GFP2600 PSA (Photoelastic Stress Analysis) System.
This video demonstrates real-time strain analysis of a 3 Mil LDPE (Low Density Polyethylene) plastic sheet acquired with the GFP2600 PSA (Photoelastic Stress Analysis) System.
GFP2600 System Applications
Below is a sampling of GFP™2600 images.
Architectural Glass
Typical data captured with GFP2600 STRIP camera(s) “stitched” together to create large images. Cameras are positioned above a conveyer.
Automotive Backlite Defroster
An interrogable thermal stress image has been extracted from live video for analysis. Shear 45 stress not directly affected by thermal stress state. Difference of cool/heated conditions to see change in stress state. Temper pattern removed.
Automotive Backlite Defroster
An interrogable thermal stress image has been extracted from live video for analysis. Shear 0 stress not directly affected by thermal stress state. Difference of cool/heated conditions to see change in stress state. Temper pattern removed.
Multi Crystalline Si Thermal Stress
The image above was acquired with the GFP™1500. The GFP™2600 NIR/SWIR Stress Measurement System is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!
Si Wafer Laser Drilled Holes
Stress from Laser Drilled Holes in Si Wafer. Image acquired with the GFP™1500. The GFP™2600 NIR/SWIR system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!
Si Wafer Crack
Crack detection via stress in multi crystalline Si wafer. Image acquired with the GFP™1500. The GFP™2600 system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!
Si Disk in Diametral Compression
The image above was acquired with the GFP™1500. The GFP™2600 NIR/SWIR Stress Measurement System is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!
Crystal Orientation of Si Wafer
Polarization due to crystal orientation of Si wafer. Image acquired with the GFP™1500. The GFP™2600 system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!
Si Wafer Crack
Stress near a crack at the edge of a single crystal Si wafer. Image acquired with the GFP™1500. The GFP™2600 system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!
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GFP2600 Specifications
| SPECIFICATION | VALUE |
|---|---|
| Size | 76mm w × 105mm h × 60mm d |
| Range | 1000nm |
| Repeatability | 2% |
| Accuracy | 0–10nm ± 0.5nm 10–100nm ± 5nm 100nm ± 5% |
| Frame Rate | 10 f/s |
| Resolution | Pixel Resolution: 2750 × 1080 |
| Lenses | Any C-Mount Lens |
| Interface | GigE |
| Specifications are general. Definitive specifications are determined by application and will be reflected in final quote. |
Need help? Email our expert support team via our contact form or call us at +1 (608) 224-1230
Need help? Email our support
team via our contact form
or call us at +1 (608) 224-1230
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