Stress Photonics’ systems work on a wide variety of silicon products including silicon coated glass, single crystal wafers, multicrystaline wafers, and micro-machined devices. Most GFP (Grey Field Polariscope) PSA (Photoelastic Stress Analysis) systems can be made into a silicon stress measurement tool with proper selection of a NIR or SWIR camera and compatible optics. Anything from areas 200m x 200mm to microscopic fields-of-views can be accommodated. Analysis can be done real-time (stress video), or via static stress images.

• Edge Stress
• Area Stress / Temper Patterns
• Thermal Stress
• Defect Detection
• Crystal Orientation