Si Wafer Laser Drilled Holes

Stress from Laser Drilled Holes in Si Wafer. Image acquired with the GFP™1500. The GFP™2600 NIR/SWIR system is fully capable of acquiring the same stress image; however, with the GFP2600, image acquisition is instantaneous!

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Need help? Email our support
team via our contact form
or call us at +1 (608) 224-1230

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